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QUADMO747-X/OMAP3

Qseven® Rel.1.20 Compliant Module based on Texas Instruments® OMAP™ 37xx Processor

Product News
19/03/2012
Manual updated
20/02/2012
Updated features and datasheet

Main Features

Highlights

  • Very low power consumption
  • 3D graphics acceleration to support display and gaming effects
  • Ideal for multimedia devices
  • Available in Extended temperature version
Application Processor

Texas Instruments® OMAP™ 37xx family:
AM 3703 (core Cortex A8 up to 1GHz)
DM3730 (core Cortex A8 up to 1GHz + PowerVR SGX Graphics Accelerator + Up to 800MHz TMS320C64x+™ DSP Core)
Memory

Mobile DDR 128MB / 256MB / 512MB
Mass Storage 256 MB / 512 MB / 1GB NAND Flash
Up to 16GB eMMC soldered onboard
Display

LVDS 18/24 Bit Single/Dual Channel
Resolution Up to 1366 x 768
Ethernet

10/100 Base-T interface
USB 1 x USB OTG
2 x USB2.0 Host
Serial Ports

2 x Serial ports
CAN interface
MMC/HC MMC/SD/SDHC/SDIO interface
Audio AC ‘97 / I2S Audio Interface
LPC Bus  
SM Bus  
SPI / One wire Interface
I2C Bus  
Temperature 0°C ÷ +70°C (commercial version)
-40°C ÷ +85°C (industrial version)
Video Input Port / Camera Connector 

Compliant to QSeven® Rel.1.20 specifications

 

SECO is founding member of QSeven® Consortium

 

More information about this product and reserved material (Application Notes, FAQ, BSP), can be found on our site http://www.secoqseven.com
quadmo747_x_omap3_datasheet_rel2_0.pdf

*User need to register to site before download reserved files. Please if you are a registered user log in in USER AREA

quadmo747_x_omap3_manual_rel1_4.pdf *

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